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Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

机译：在玻璃基板上用芯片附着膜对半导体薄芯片进行室温超声键合

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Department of Electrical Engineering

机译：电机工程系

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Or SW; Wong SY; Wong HC; Cheung YM; Choy PK;
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年度 2008
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正文语种 eng
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1. Room-Temperature Ultrasonic Bonding of Semiconductor Thin-Dies with Die Attach Films on Glass Substrates [J] . Sui Yin Wong, Siii Wing Or, Ho Chi Wong, Japanese journal of applied physics . 2009,第7issue2期

机译：玻璃基板上带有芯片贴装膜的半导体薄模的室温超声键合
2. Synthesis and characterization of amorphous Fe_(2.75)Dy-oxide thin films demonstrating room-temperature semiconductor, magnetism, and optical transparency [J] . Krishna Prasad Koirala, Aniruddha Deb, Sara Bey, Journal of Applied Physics . 2021,第3期

机译：非晶Fe_（2.75）Dy氧化物薄膜的合成与表征，演示室温半导体，磁和光学透明度
3. Photoluminescence studies of spray pyrolytically grown nanostructured tin oxide semiconductor thin films on glass substrates [J] . Chacko S, Bushiri MJ, Vaidyan VK Journal of Physics, D. Applied Physics: A Europhysics Journal . 2006,第21期

机译：在玻璃基板上喷涂热解生长的纳米结构氧化锡半导体薄膜的光致发光研究
4. Ultrasonic Bonding of Die Attach Film (DAF)-Laminated Thin Silicon Dies on Glass Substrates at Room Temperature [C] . Wong Sui Yin, Wong Ho Chi, Or Siu Wing, Electronics Packaging Technology Conference . 2008

机译：模具附着薄膜（DAF）的超声波键合在室温下玻璃基板上的薄硅模具
5. Characterization of Indium Zinc Oxide, Indium Tin Oxide, and Molybdenum Thin Films on Flexible Glass Substrates Deposited via Roll-to-roll Sputter Deposition Processes [D] . Bezama, Christian. 2019

机译：通过轧制溅射沉积工艺沉积在柔性玻璃基板上的氧化铟锌，氧化铟锡和钼薄膜的表征
6. A Spherically-Shaped PZT Thin Film Ultrasonic Transducer with an Acoustic Impedance Gradient Matching Layer Based on a Micromachined Periodically Structured Flexible Substrate [O] . Guo-Hua Feng, Wei-Fan Liu 2013

机译：基于微机械周期结构柔性基板的具有声阻抗梯度匹配层的球形PZT薄膜超声换能器
7. Room-temperature ultrasonic bonding of semiconductor thin-dies with die attach films on glass substrates [O] . Wong SY, Or SW, Wong HC, 2009

机译：在玻璃基板上使用芯片附着膜将半导体薄膜进行室温超声焊接

Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

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