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>Enhancement of the machinability of silicon by hydrogen ion implantation for ultra-precision micro-cutting
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Enhancement of the machinability of silicon by hydrogen ion implantation for ultra-precision micro-cutting
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机译:通过氢离子注入提高硅的可加工性,以进行超精密微切割
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摘要
This paper presents the implementation method of surface modification by hydrogen ion implantation in silicon on the enhancement of machinability of silicon by facilitating the brittle-to-ductile transition. The distribution of the implanted hydrogen ions and induced displacements in the sub-surface of silicon wafer is visualised through modelling. The micro-cutting experiments are conducted on ultra-precision raster milling to verify the enhancement effect on the machinability of silicon.
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