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Surface plasmon polariton cross-coupling enhanced forward emission from insulator-metal-capped ZnO films

机译:表面等离子体激元极化交叉耦合增强了绝缘体金属封顶的ZnO薄膜的正向发射

摘要

Increasing light extraction efficiency in the forward direction is being extensively pursued due to its crucial role in realizing top-emitting organic and inorganic light emitting devices. Various surface plasmon polariton (SPP)-based strategies for emission enhancement and light extraction have been developed to improve the top-emitting efficiency of these devices. However, the role of surface roughness of both semiconductor film and metal electrode in improving the emission efficiency of a practical device has not been thoroughly studied yet. In this work, the influence of surface roughness of a top metal electrode on the photoluminescence enhancement of a ZnO thin film is investigated experimentally and numerically based on an insulator-metal-semiconductor system. It is found that the generic surface roughness of the metal electrode plays an encouraging role in increasing the forward-emission intensity by facilitating cross-coupling of SPPs on the two opposite sides of the metal layer. More importantly, the forward emission can be further enhanced by capping a high-index polymer layer on the metal electrode to bridge the momentum mismatch between the two SPPs modes. The experimental observations are well explained by the SPPs cross-coupling mechanism that models the radiation power of a dipolar emitter underneath the metal electrode as a function of the metal surface roughness. Our work opens up the possibility of using cross-coupling of SPPs as an effective means to fabricate high-brightness top-emitting devices without the need of complicated nanoscale patterning.
机译:由于其在实现顶部发射的有机和无机发光器件中的关键作用,因此正广泛地追求提高向前的光提取效率。已经开发了用于发射增强和光提取的各种基于表面等离子体激元(SPP)的策略,以提高这些设备的顶部发射效率。然而,尚未充分研究半导体膜和金属电极的表面粗糙度在提高实用装置的发射效率中的作用。在这项工作中,基于绝缘体-金属-半导体系统,通过实验和数值研究了顶部金属电极的表面粗糙度对ZnO薄膜的光致发光增强的影响。发现金属电极的一般表面粗糙度通过促进在金属层的两个相对侧上的SPP的交叉耦合而在增加正向发射强度中起令人鼓舞的作用。更重要的是,通过覆盖金属电极上的高折射率聚合物层以桥接两个SPP模式之间的动量失配,可以进一步增强正向发射。 SPP交叉耦合机制很好地解释了实验观察结果,该机制将金属电极下方的偶极发射极的辐射功率建模为金属表面粗糙度的函数。我们的工作开辟了使用SPP交叉耦合作为制造高亮度顶部发射器件的有效方法的可能性,而无需进行复杂的纳米级图案化。

著录项

  • 作者

    Lei DY; Zhang L; Ong HC;

  • 作者单位
  • 年度 2015
  • 总页数
  • 原文格式 PDF
  • 正文语种 eng
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