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Interfacial microstructure and electrical properties of HfAlOx thin films on compressively strained Si83Ge17 grown by RF magnetron sputtering

机译:射频磁控溅射在压缩应变Si83Ge17上HfAlOx薄膜的界面微观结构和电性能

摘要

Interfacial microstructure and electrical properties of HfAlOx films deposited by RF magnetron sputtering on compressively strained Si83Ge17/Si substrates were investigated. HfSiOx-dominated amorphous interfacial layer (IL) embedded with crystalline HfSix nano-particles were revealed by high resolution transmission electron microscopy (HRTEM) and X-ray photoelectron spectroscopy depth profile study. About 280 mV-wide clockwise capacitance-voltage(C-V) hysteresis for the HfAlOx film deposited in Ar + N2 mixed ambient was observed. Oxygen vacancies and interfacial defects in the HfSiOx IL, as well as trapped charges in the boundaries between the HfSix nano-particles and surrounded amorphous HfSiOx may be responsible for the large C-V hysteresis.
机译:研究了射频磁控溅射在压缩应变的Si83Ge17 / Si衬底上沉积的HfAlOx膜的界面微观结构和电学性能。通过高分辨率透射电子显微镜(HRTEM)和X射线光电子能谱深度剖面研究揭示了嵌入晶体HfSix纳米粒子的HfSiOx为主的非晶界面层(IL)。对于在Ar + N2混合环境中沉积的HfAlOx膜,观察到约280 mV宽的顺时针方向的电容电压(C-V)滞后。 HfSiOx IL中的氧空位和界面缺陷,以及HfSix纳米粒子与周围无定形HfSiOx之间的边界中捕获的电荷可能是造成大的C-V滞后的原因。

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