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Experimental study on intermediate crack debonding in FRP-strengthened RC flexural members

机译:FRP加固钢筋混凝土受弯构件中间裂缝脱胶的试验研究

摘要

A commonly observed failure mode of reinforced concrete (RC) flexural members strengthened with a fibre reinforced polymer (FRP) plate bonded to their tension face involves debonding that initiates at a major flexural or flexural shear crack and propagates towards a plate end, which has often been referred to as intermediate crack (IC) debonding. This paper first presents the results of IC debonding tests conducted on eighteen cantilever slabs in which IC debonding initiated at or near the fixed end, and four simply-supported slabs in three-point bending where IC debonding initiated at the load position. A number of factors are covered by these tests, including the type of FRP material, the width of FRP strip, the length of FRP strip, the slab width, the concrete strength, the longitudinal steel ratio, the concrete cover, and pre-cracking of concrete. The test results are next used to assess the accuracy of four available strength models that can be used to design against IC debonding. Of these four models, Teng et al's (2003) model is shown to provide safe predictions of the test results in most cases but can lead to overly conservative results; the scatter of the predictions is also large. The other three models from recent design guidelines (JSCE, 2001, fib 2001, ACI 440 2002) are not sufficiently safe for use in design. This assessment clearly illustrates the need for much further research to develop a more accurate IC debonding strength model.
机译:通常观察到的钢筋混凝土受弯构件的破坏模式是通过将纤维增强聚合物(FRP)板粘结到其受拉面上来进行加固的,这种破坏模式包括在主要挠曲或挠曲剪切裂缝处开始并向板端传播的脱粘,该端通常被称为中间裂纹(IC)脱胶。本文首先介绍了在18个悬臂平板上进行IC脱胶测试的结果,其中在固定端或固定端附近开始IC脱胶;在四个点进行了三点弯曲的简单支撑平板,其中IC脱胶在负载位置开始。这些测试涵盖了许多因素,包括玻璃钢材料的类型,玻璃钢带的宽度,玻璃钢带的长度,板坯宽度,混凝土强度,纵向钢比,混凝土覆盖层和预开裂混凝土。接下来,将测试结果用于评估四个可用强度模型的准确性,这些强度模型可用于设计以防止IC脱粘。在这四个模型中,Teng等人(2003)的模型在大多数情况下可提供对测试结果的安全预测,但会导致过于保守的结果;预测的分散性也很大。最近的设计指南(JSCE,2001,FIB 2001,ACI 440 2002)中的其他三种模型在设计中使用时不够安全。该评估清楚地表明,需要进行更多的研究来开发更准确的IC剥离强度模型。

著录项

  • 作者

    Yao J; Teng JG; Lam L;

  • 作者单位
  • 年度 2005
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  • 原文格式 PDF
  • 正文语种 eng
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