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Fabrication of polymer silver conductor using inkjet printing and low temperature sintering process

机译:喷墨印刷和低温烧结工艺制备聚合物银导体

摘要

In this paper, silver powders with a uniform particle size of 0.2-0.4 μm and an excellent dispersibility were applied to produce a conductive ink for the inkjet printing process. The thermal behaviors of silver particles sintered at different temperature were investigated through X-ray diffraction (XRD) patterns. It was found out that both the particle size and crystal grains increase during the surface diffusion and sintering process. A drop-on-demand (DOD) inkjet printing system was employed to print the conductor by using as-mentioned silver particles suspended in terpineol/polyketone (PK) system as conductive materials. The optimized value of W PK/W silver was 5%, corresponding to a resistivity of 2.0 μΩ · cm. It was revealed that an increase in the W PK/W silver ratio resulted in the increase in both the resisitivity and adhesion strength of the conductor. The scanning electron microscopy (SEM) analysis based on the microstructures of silver conductor further illustrates that the densification of conductor and long-range interparticle connectivity ensure the silver conductor a low resistivity. The adhesiveness effect from PK resin enables the conductor a high adhesion strength.
机译:在本文中,将具有0.2-0.4μm的均一粒度和优异的分散性的银粉用于生产用于喷墨印刷工艺的导电油墨。通过X射线衍射(XRD)图谱研究了在不同温度下烧结的银颗粒的热行为。已发现在表面扩散和烧结过程中,粒径和晶粒均增加。采用按需滴注(DOD)喷墨打印系统,通过使用悬浮在萜品醇/聚酮(PK)系统中的上述银颗粒作为导电材料来打印导体。 W PK / W银的最佳值为5%,对应于2.0μΩ·cm的电阻率。揭示了W PK / W银比的增加导致导体的电阻率和粘附强度的增加。基于银导体微观结构的扫描电子显微镜(SEM)分析进一步表明,导体的致密化和长距离粒子间连接确保了银导体的低电阻率。 PK树脂的粘合效果使导体具有较高的粘合强度。

著录项

  • 作者

    Wu SP; Yung KC; Xu LH; Ding XH;

  • 作者单位
  • 年度 2008
  • 总页数
  • 原文格式 PDF
  • 正文语种 eng
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