Optimization of process conditions for the transfer molding of electronic packages

摘要

Transfer molding is used extensively in electronic packaging. To achieve a high production rate and high molding quality, it is necessary to have strict control on the epoxy resin characteristics as well as identify the optimal process conditions of the transfer molding. In this paper, process simulations of transfer molding for electronic packages were conducted according to Taguchi experiments. The simulation results were then used to derive quality indexes by using TOPSIS (techniques for order preference by similarity of ideal solution) algorithm. Through the analysis of the quality indexes, optimal process conditions can be identified. Two verification tests were carried out and results of the tests are found very close to the predictions. This project has demonstrated that numerical simulation combining with Taguchi method and TOPSIS can be a useful tool for optimization of process conditions for transfer molding of electronic packages.