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An alternative process for electroless copper plating on polyester fabric

机译:在涤纶织物上进行化学镀铜的另一种方法

摘要

Electroless copper plating of polyester fabrics was demonstrated in the present investigation. The electroless Cu plating process on polyester fabric was modified by replacing the conventional PdCl 2 activator with an AgNO 3 activator to reduce the overall cost of the plating process. Both uncoated and Cu-coated polyester fabrics were characterized by the scanning electron microscope (SEM), energy dispersive spectroscopy (EDX), X-ray diffraction analysis (XRD) and X-ray photoelectron spectroscope (XPS). Relatively uniform and continuous plating was obtained under the given plating conditions. The possible mechanism of electroless copper plating of polyester fabrics utilizing an AgNO 3 activator was suggested. The electromagnetic interference (EMI) shielding effectiveness (SE) was also evaluated to study the shielding behavior of copper-plated polyester fabrics. The results demonstrated that copper-plated polyester fabrics can be applied for EMI shielding.
机译:在本研究中证明了聚酯织物的化学镀铜。通过用AgNO 3活化剂代替常规的PdCl 2活化剂,对聚酯织物上的化学镀Cu工艺进行了改进,以降低整个电镀过程的成本。通过扫描电子显微镜(SEM),能量色散光谱(EDX),X射线衍射分析(XRD)和X射线光电子能谱(XPS)对未涂层和铜涂层的聚酯织物进行了表征。在给定的电镀条件下可获得相对均匀和连续的电镀。建议使用AgNO 3活化剂对聚酯织物进行化学镀铜的可能机理。还评估了电磁干扰(EMI)屏蔽效能(SE),以研究镀铜聚酯织物的屏蔽行为。结果表明,镀铜聚酯织物可用于EMI屏蔽。

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