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Influence of size effect on the springback of sheet metal foils in micro-bending

机译:尺寸效应对微弯曲中金属薄板回弹的影响

摘要

To analyze the unloading springback of sheet metal foils after micro-bending process, a constitutive model is proposed based on the surface layer model by which the sheet foil is divided into surface layer and inner portions. For the inner portion, each grain is envisaged as a composite, comprised of grain interior and grain boundary work-hardened layer. The classical composite model is then used to calculate its flow stress. For the surface layer portion, a model without grain boundary strengthening is constructed to represent the flow stress in this zone. The developed method is verified through the comparison of the calculated strain-stress curves with the tensile test results of four kinds of pure copper sheet foils with different thicknesses ranging from 0.1 mm to 0.6 mm. To investigate the effect of thickness and grain size on the springback of pure copper sheet foils, three-point bending tests are carried out. A finite element (FE) model for predicting the springback in micro-bending process is further developed, which takes into account the deformation behavior and orientation of each grain. The influences of grain size and thickness on the springback of sheet foils are investigated. The research results show that the decrease of sheet foil thickness or the increase of grain size results in a big springback. The scatter of springback angle is mainly attributed to the elastic anisotropy of surface grains and increases with the reduction of grains along the thickness direction. A good agreement between the experimental results and the analytical calculations shows that the developed FE model can predict the springback of sheet metal foils well in micro-bending process.
机译:为了分析薄金属箔在微弯加工后的卸载回弹,提出了基于表面层模型的本构模型,将薄板箔分为表面层和内部。对于内部,每个晶粒被设想为复合材料,包括晶粒内部和晶界加工硬化层。然后使用经典复合模型计算其流应力。对于表层部分,构建了没有晶界强化的模型来表示该区域中的流动应力。通过将计算出的应变-应力曲线与四种厚度在0.1 mm至0.6 mm之间的纯铜箔的拉伸试验结果进行比较,验证了该方法的有效性。为了研究厚度和晶粒尺寸对纯铜板箔回弹的影响,进行了三点弯曲试验。进一步开发了用于预测微弯曲过程中回弹的有限元模型,该模型考虑了每个晶粒的变形行为和取向。研究了晶粒尺寸和厚度对薄箔回弹的影响。研究结果表明,降低箔片厚度或增加晶粒尺寸会导致较大的回弹。回弹角的散布主要归因于表面晶粒的弹性各向异性,并且随着晶粒沿厚度方向的减少而增加。实验结果与解析计算结果吻合良好,表明所建立的有限元模型可以很好地预测金属板在微弯过程中的回弹。

著录项

  • 作者

    Liu JG; Fu MW; Lu J; Chan WL;

  • 作者单位
  • 年度 2011
  • 总页数
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类

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