Analysis of Mode II debonding behavior of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading

摘要

This paper presents a set of closed-form solutions for Mode II debonding process of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading. Six different bond-slip models are considered in deriving the closed-form solutions. For each bond-slip model, explicit expressions for the debonding load, effective bond length, interfacial shear stress, interfacial slip as well as the load-displacement response are presented. Provided the bond length is sufficiently long, the debonding load depends only on the interfacial fracture energy and the temperature variation. A temperature increase leads to an increase in both the debonding load and the effective bond length, and the rate of increase of the latter depends on the bond-slip model of the interface.