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Improved interfacial quality of GaAs metal-oxide-semiconductor device with NH3-plasma treated yittrium-oxynitride as interfacial passivation layer

机译:NH3等离子体处理的钇氧氮化物作为界面钝化层的GaAs金属氧化物半导体器件的界面质量提高

摘要

The interfacial and electrical properties of GaAs metal-oxide-semiconductor capacitors with yittrium-oxynitride interfacial passivation layer treated by N-2/NH3-plasma are investigated, showing that lower interface-state density (1.24 x 10(12) cm(-2) eV(-1) near midgap), smaller gate leakage current density (1.34 x 10(-5) A/cm(2) at V-fb + 1 V), smaller capacitance equivalent thickness (1.43 nm), and larger equivalent dielectric constant (24.5) can be achieved for the sample with NH3-plasma treatment than the samples with N-2-/no-plasma treatment. The mechanisms lie in the fact that NH3-plasma can provide not only N atoms, but H atoms and NH radicals to effectively passivate the high-k/GaAs interface, thus less pinning the Femi level at high-k/GaAs interface.
机译:研究了用N-2 / NH3-等离子体处理的具有钇-氧氮化物界面钝化层的GaAs金属氧化物半导体电容器的界面和电学性质,表明较低的界面态密度(1.24 x 10(12)cm(-2) )eV(-1)(接近中间间隙),较小的栅极泄漏电流密度(在V-fb +1 V时为1.34 x 10(-5)A / cm(2)),较小的电容等效厚度(1.43 nm)和较大的等效电容与采用N-2- /无等离子体处理的样品相比,经NH3等离子体处理的样品的介电常数(24.5)。其机理在于,NH 3-等离子体不仅可以提供N原子,而且可以提供H原子和NH基团以有效地钝化高k / GaAs界面,从而较少地将Femi能级固定在高k / GaAs界面上。

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