Presented work shows the results of DSC measurement for six Sn based solders. The alloysSn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied inthe temperature range from room temperature up to 400◦C. The transformation temperaturesfor melting as well as for solidification were influenced by the composition and thermal historyof the alloys. The thermal history was altered by changing the maximum thermal cycle temperatureand the heating/cooling rate. It is shown that the rate of solidification is far largerthan that of the melting. The solidification rate is not influenced by neither the compositionnor the thermal history of the material. Analysis of these results is presented.
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