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Wetting Force Measurement of the Different Types of Solders and Testing Materials

机译:不同类型焊料和测试材料的润湿力测量

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摘要

We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity of the solder. We have measured a combination of different types of the lead and lead-free solders and different types of the testing materials. The measurement was carried out on nine different types of solders (Sn63Pb37, Sn95Sb5, Sn95Sb3,5Cul,5, Sn96Ag4, Sn95,5Ag3,8Cu0,7, Sn97Bi2Cul, Sn97Cu3, Sn99Cul, Sn99,75), three types of testing materials (copper, nickel and brass) and three types of fluxes. All measurements nine solders ware measured in ambient atmosphere and two lead-free solders were (Sn96Ag4, Sn95,5Ag3,8CuO,7) measured in inert atmosphere. The results of measurements we classified into the table according to he shape of wetting curve and according to the visual control.
机译:我们使用了最常用的润湿性评估方法之一-润湿平衡(胶凝图)方法来测量润湿力。我们对测量设备进行了修改,以测量更少的焊料。我们测量了不同类型的铅和无铅焊料以及不同类型的测试材料的组合。对9种不同类型的焊料(Sn63Pb37,Sn95Sb5,Sn95Sb3、5Cul,5,Sn96Ag4,Sn95、5Ag3、8Cu0,7,Sn97Bi2Cul,Sn97Cu3,Sn99Cul,Sn99,75),三种测试材料(铜)进行了测量,镍和黄铜)和三种类型的助焊剂。所有测量都在惰性气氛中测量了九种焊剂,并在惰性气氛中测量了两种无铅焊料(Sn96Ag4,Sn95、5Ag3、8CuO,7)。根据润湿曲线的形状和视觉控制,将测量结果分类为表格。

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