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Influence of Curing Process Parameters on Quality of Electrically Conductive Joints

机译:固化工艺参数对导电接头质量的影响

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摘要

Curing parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more important for achievement of the low electrical resistance and low nonlinearity of a current vs. voltage characteristic of an adhesive joint. A method of factorial experiments of the type 22 and Taguchi orthogonal array of the type L4 were used for this study. It was found that the joint resistance is mostly influenced by the curing time, less by the curing temperature and the lowest influence has the interaction of the time/temperature. Nonlinearity is also influenced mostly by the curing time and less by the curing temperature and by the interaction time/temperature.
机译:导电胶的固化参数是温度和时间。这些参数由粘合剂制造商推荐。这项工作的目的是发现这些参数中的哪一个对于实现胶粘接头的低电阻和电流-电压特性的低非线性更为重要。本研究使用了22型的析因实验方法和L4型的Taguchi正交阵列。发现接合电阻主要受固化时间的影响,受固化温度的影响较小,并且时间/温度的相互作用影响最小。非线性也主要受固化时间的影响,而受固化温度和相互作用时间/温度的影响较小。

著录项

  • 作者

    Barto Seba; Mach Pavel;

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  • 年度 2010
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  • 原文格式 PDF
  • 正文语种 ces
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