Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints

摘要

The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation of microstructure development of the solder, solder/PCB pad interface and on the measurement of the solder joints nonlinearity of the current-voltage (C-V) characteristics. The microstructure is evaluated before and after accelerated ageing.