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An approach for impression creep of lead-free microelectronic solders

机译：一种无铅微电子焊料的压痕蠕变的方法

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Approved for public release; distribution is unlimited

机译：批准公开发布；发行是无限的

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Anastasio Onofrio A.;
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年度 2002
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1. A comparison of impression, indentation and impression-relaxation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders at room temperature [J] . R. Mahmudi, A. R. Geranmayeh, H. Noori, Journal of materials science . 2008,第5期

机译：无铅Sn-9Zn和Sn-8Zn-3Bi焊料在室温下的压痕，压痕和压痕松弛蠕变的比较
2. Impression Creep Characterization of 90Pb-10Sn Microelectronic Solder Balls at Subsolvus and Supersolvus Temperatures [J] . D.PAN, DUTTA, S.G.JADHAV, Journal of Electronic Materials . 2005,第7期

机译：亚溶解度和超溶解度温度下90Pb-10Sn微电子焊锡球的蠕变特征
3. Impression Creep Characterization of 90Pb-10Sn Microelectronic Solder Balls at Subsolvus and Supersolvus Temperatures [J] . D.PAN, DUTTA, S.G.JADHAV, Journal of Electronic Materials . 2005,第7期

机译：亚溶解度和超溶解度温度下90Pb-10Sn微电子焊锡球的蠕变特征
4. CREEP BEHAVIOR OF LEAD FREE SOLDER INTERCONNECTS IN MICROELECTRONIC PACKAGES: IMPRESSION CREEP TESTING AND CONSTITUTIVE MODELING [C] . I. Dutta, D. Pan, S. Jadhav, American Society of Mechanical Engineers(ASME)/Pacific RIM Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 pt.B; 20050717-22; San Francisco,CA(US) . 2005

机译：微电子封装中无铅焊料互连的蠕变行为：压痕测试和本构模型
5. An analysis of global and localized creep strains and creep properties of non-composite lead-free solders at room and elevated temperatures. [D] . McDougall, Jeffrey Lee. 1998

机译：在室温和高温下对非复合无铅焊料的整体和局部蠕变应变和蠕变特性的分析。
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Modeling of impression testing to obtain mechanical properties of lead-free solders microelectronic interconnects [O] . How Yew Seng. 2005

机译：建模压模测试以获得无铅焊料微电子互连的机械性能

An approach for impression creep of lead-free microelectronic solders

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