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Design of a VLSI charge-coupled device analog delay line

机译:VLSI电荷耦合器件模拟延迟线的设计

摘要

Charge coupled devices (CCDs) are semiconductor devices which can transfer information, represented by a quantity of electrical charge, from one physical location of the semiconductor substrate to another in a controlled manner with the use of properly sequenced clock pulses. These devices can be applied to imaging, signal processing, logic, and digital storage applications. In this thesis, the design of an electrically stimulated CCD analog delay line, using the design tools currently available at the Naval Postgraduate School, is reported on. The major issues addressed are the electrode gate structure and composition, charge confinement techniques, and clocking schemes. Additionally, techniques for inpuning and detecting charge packets from the CCD register are examined. The Metal Oxide Semiconductor Integration Service (MOSIS) design rules only permit Bulk Channel Charge Couple Devices (BCCDs) to be lald out, and not Surface Channel Charge Coupled Devices (SCCDs). Restricted to a die size of 2.24 mm length, the electrode gates were chosen to be polysilicon polysilicon 8 micron length with 2 micron overlap and 20 micron width, giving the BCCD 64 stages. An on chip four phase clocking circuit with output drivers on each phase provides the control voltage for the gate electrodes. The small width of the BCCD delay line utilizes only a small portion of the available 2.22 mm die width. Therefore, four different BCCDs were designed in the layout. Two of the BCCDs have a p-diffusion stop to contain the charge laterally as it propagates along the channel while two BCCDs do not. Additionally, two of the BCCDs utilize the charge partition input technique with three control gates and two BCCDs use the dynamic current injection with one control gate.
机译:电荷耦合器件(CCD)是一种半导体器件,可以使用适当排序的时钟脉冲以受控的方式将信息(以电荷量表示)从半导体衬底的一个物理位置传输到另一物理位置。这些设备可以应用于成像,信号处理,逻辑和数字存储应用。本文报道了利用海军研究生院目前可用的设计工具设计电激发CCD模拟延迟线的方法。解决的主要问题是电极栅极的结构和组成,电荷限制技术和时钟方案。此外,还研究了用于检查和检测来自CCD寄存器的电荷包的技术。金属氧化物半导体集成服务(MOSIS)设计规则仅允许淘汰大通道电荷耦合器件(BCCD),而不允许表面通道电荷耦合器件(SCCD)。限制为2.24 mm长的芯片尺寸,电极栅被选择为长度为8微米,重叠2微米,宽度为20微米的多晶硅,提供BCCD 64级。片上四相时钟电路在每相上具有输出驱动器,为栅电极提供控制电压。 BCCD延迟线的小宽度仅占用了2.22 mm裸片宽度的一小部分。因此,在布局中设计了四种不同的BCCD。两个BCCD具有p扩散停止点,以在电荷沿通道传播时横向包含电荷,而两个BCCD则不。此外,其中两个BCCD使用带有三个控制门的电荷分配输入技术,两个BCCD使用一个控制门使用动态电流注入。

著录项

  • 作者

    Gedra David R.;

  • 作者单位
  • 年度 1995
  • 总页数
  • 原文格式 PDF
  • 正文语种 en_US
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