Processing and characterization of NiTi Shape Memory Alloy particle reinforced Sn-In solder

摘要

of the solder. In this thesis, a new fabrication process for incorporating NiTi particles (10 vol.% NiTi) into Sn-In solder (80Sn-20In) using liquid phase sintering has been developed. The microstructures of the solders were characterized. The behavior of the solder joints during thermomechanical cycling was also characterized and the results showed that the shear stress induced in the composite solder joint is significantly reduced relative to that in the monolithic solder joint due to the generation of a back-stress associated with the B19Å fÅ *B2 phase transformation of the NiTi particles during the heating part of the cycle. This causes an appreciable reduction of the total inelastic strain range during cycling.