Design of a folded-patch chip-size antenna for short-range communications

摘要

We report on design of an integrated foldedshorted-patch (FSP) chip-size antenna for operation at5.7 GHz and use in short-range wireless communications.Application of wafer-level chip-scale packaging (WLCSP)techniques like adhesive wafer bonding and through-waferelectrical via formation, combined with the selected antennatype allows antenna on-chip integration. The operatingcharacteristics of a folded S-P antenna built on two stackedglass substrates were analysed with respect to substratethickness, middle patch length and substrate sidewallangles. Antenna size reduction down to 4x4x1 mm3,efficiency of 66% and bandwidth of 62 MHz are predicted.