Spiral inductors on silicon for wireless communications

摘要

This paper presents the design and fabrication of integrated micromachined inductors obn silicon substrates. In order to reduce eddy currents in silicon substrates, bulk-micromachining technology is used to etch the silicon wafer. In this way, aluminum spiral micromachined inductors can achieve a quality factor Q of approximately 30 (0.6-2 nH @ 2-15 GHz). Also, the resistivity of the inductors material is discussed.