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FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact

机译：有限元分析对铜线键合冲击下BEoL结构的破坏和开裂风险的处理

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Auersperg Jürgen; Breuer D.; Machani K.V.; Rzepka Sven; Michel Bernd;
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年度 2016
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1. Novel Method of Separating Probe and Wire Bond Regions Without Increasing Die Size and Reducing Weak Fab-BEOL Adhesion Interfaces [J] . Chu-Chung (Stephen) Lee, Tu Anh Tran, Bill Williams, Advancing Microelectronics . 2006,第5期

机译：分离探针和引线键合区域而不增加芯片尺寸并减少弱Fab-BEOL粘合界面的新方法
2. Impact of electroplated copper thickness on copper CMP and Cu/Coral™ BEOL integration [J] . C.H. Seah, G.Z. You, S.R. Wang, Microelectronic Engineering . 2005,第1期

机译：电镀铜厚度对铜CMP和Cu / Coral™BEOL集成的影响
3. Effect of in-situ free air ball laser heating on bonding strength and grain structure for copper wire bond [J] . Singh Gurbinder, Haseeb Abdul S.Md Abdul Journal of materials science . 2017,第18期

机译：原位自由球激光加热对铜丝键合强度和晶粒结构的影响
4. FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact [C] . Auersperg J., Breuer D., Machani K.V., International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2015

机译：铜线键合冲击下BEoL结构的损伤和开裂风险的有限元分析
5. Structural Optimization & Reliability of 3D Package by Studying Crack Behavior on TSV & BEOL & Impact of Power Cycling on Reliability Flip Chip Package [D] . Rahangdale, Unique. 2017

机译：三维封装的结构优化及可靠性研究TSV＆BEOL裂缝行为及功率循环对可靠性倒装芯片封装的影响
6. Structure and electrochemical properties of copper wires with seamless 1D nanostructures [O] . Yutong Wu, Meiqi Gao, Song Li, 2018

机译：具有无缝一维纳米结构的铜线的结构和电化学性能
7. Incorporating Niobium in MoS 2 at BEOL‐Compatible Temperatures and its Impact on Copper Diffusion Barrier Performance [O] . Rui Zhao, Chun‐Li Lo, Fu Zhang, 2019

机译：在BEOL兼容温度下掺入MOS 2的铌及其对铜扩散屏障性能的影响
8. Localized Damage in a Viscous Medium (Glass). Appendix A. Variations in Localized Impact Damage Caused by Nominally Similar Impacts. Appendix B. Crack Branching at Hertz Cracks. [R] . kirchner,henry p. gruver,robert m. 1977

机译：粘性介质（玻璃）中的局部损伤。附录a.名义上相似影响引起的局部影响损害的变化。附录B.赫兹裂纹处的裂纹分支。

FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact

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