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Investigation of buffer traps in an AlGaN/GaN/Si high electron mobility transistor by backgating current deep level transient spectroscopy

机译:通过背电流电流深能级瞬态光谱研究AlGaN / GaN / Si高电子迁移率晶体管中的缓冲陷阱

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摘要

The influence of a substrate voltage on the dc characteristics of an AlGaN/GaN high electron mobility transistor (HEMT) on silicon (111) substrate is profited to investigate traps that are located between the substrate and the two-dimensional electron gas channel. The transient of the drain current after applying a negative substrate voltage is evaluated in the temperature range from 30 to 100 degreesC. With this method, known as backgating current deep level transient spectroscopy, majority carrier traps with activation energy of 200 meV as well as minority carrier traps at 370 meV are identified. The experiments are performed on completed HEMTs, allowing the investigation of the influence of device fabrication technology. (C) 2003 American Institute of Physics.
机译:衬底电压对硅(111)衬底上的AlGaN / GaN高电子迁移率晶体管(HEMT)的dc特性的影响对于研究位于衬底和二维电子气通道之间的陷阱很有帮助。在30到100摄氏度的温度范围内评估施加负衬底电压后的漏极电流瞬态。使用这种称为背向电流深电平瞬态光谱法的方法,可以识别出具有200 meV活化能的多数载流子阱以及370 meV的少数载流子阱。实验是在完整的HEMT上进行的,从而可以研究器件制造技术的影响。 (C)2003美国物理研究所。

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