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Comparison of AlGaN/GaN MSM Varactor Diodes Based on HFET and MOSHFET Layer Structures

机译:基于HFET和MOSHFET层结构的AlGaN / GaN MSM变容二极管的比较

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摘要

In this letter, the performance of AlGaN/GaN-based metal-semiconductor-metal (MSM) varactor diodes based on HFET and MOSHFET layer systems is investigated. Passivated HFET MSM devices are coated with a 10-nm-thick SiO2 layer between the electrodes; in MOSHFET-based diodes, this layer is also used as an insulator underneath the gate. Device fabrication uses standard HFET fabrication technology, allowing easy integration in monolithic microwave integrated circuits. Devices with different electrode geometry are characterized by direct current and by S-parameter measurements up to 50 GHz. The HFET-based varactors show capacitance ratios up to 14 and cutoff frequencies up to 74 GHz. The MOSHFET-based devices, on the other hand, show lower capacitance ratios and poorer stability because of the insulation layer between electrodes and semiconductor.
机译:在这封信中,研究了基于HFET和MOSHFET层系统的AlGaN / GaN基金属半导体金属(MSM)变容二极管的性能。钝化的HFET MSM器件在电极之间涂有10纳米厚的SiO2层。在基于MOSHFET的二极管中,该层还用作栅极下方的绝缘体。器件制造使用标准的HFET制造技术,可轻松集成到单片微波集成电路中。具有不同电极几何形状的设备的特点是直流电和高达50 GHz的S参数测量值。基于HFET的变容二极管的电容比高达14,截止频率高达74 GHz。另一方面,基于MOSHFET的器件由于电极和半导体之间的绝缘层而显示出较低的电容比和较差的稳定性。

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