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Improved electro-mechanical performance of gold films on polyimide without adhesion layers

机译：改善了不带粘合层的聚酰亚胺上金膜的机电性能

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Putz Barbara; Schoeppner Rachel L.; Glushko Oleksandr; Bahr David F.; Cordill Megan J.;
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1. Improved electro-mechanical performance of gold films on polyimide without adhesion layers [J] . Putz Barbara, Schoeppner Rachel L., Glushko Oleksandr, Scripta materialia . 2015,第Null期

机译：改进的不带粘合层的聚酰亚胺上金膜的机电性能
2. Hot-Press-Assisted Adhesions between Polyimide Films and Titanium Plates Utilizing Coating Layers of Silane Coupling Agents [J] . Hashizume Mineo, Fukagawa Soichiro, Mishima Shoko, Langmuir: The ACS Journal of Surfaces and Colloids . 2016,第47期

机译：利用硅烷偶联剂涂层的聚酰亚胺薄膜与钛板之间的热压辅助粘合
3. Hot-Press-Assisted Adhesions between Polyimide Films and Titanium Plates Utilizing Coating Layers of Silane Coupling Agents [J] . Hashizume Mineo, Fukagawa Soichiro, Mishima Shoko, Langmuir: The ACS Journal of Surfaces and Colloids . 2016,第47期

机译：利用硅烷偶联剂涂层的聚酰亚胺薄膜与钛板之间的热压辅助粘合
4. Improved Performance Thermal Stability in Plasmonic Films with Thinner Adhesion Capping Layers [C] . William M. Abbott, Christopher P. Murray, Chuan Zhong, Conference on Lasers and Electro-Optics . 2018

机译：具有较薄粘合层和封盖层的等离子膜的性能和热稳定性得到改善
5. An investigation of plasma pretreatments and plasma polymerized thin films for titanium/polyimide adhesion. [D] . DiFelice, Ronald Attilio. 2001

机译：等离子预处理和等离子聚合薄膜对钛/聚酰亚胺附着力的研究。
6. Improved electro-mechanical performance of gold films on polyimide without adhesion layers [O] . Barbara Putz, Rachel L. Schoeppner, Oleksandr Glushko, -1

机译：改善了不带粘合层的聚酰亚胺上金膜的机电性能
7. Effects of Interlayers on the Scratch Adhesion Performance of Ultra-Thin Films of Copper and Gold on Silicon Substrates [O] . S. D. McAdams, T. Y. Tsui, W. C. Oliver, 1994

机译：中间层对硅基板上铜和金超薄膜划痕性能的影响
8. Effects of interlayers on the scratch adhesion performance of ultra-thin films of copper and gold on silicon substrates [R] . McAdams, S. D., Tsui, T. Y., Pharr, G. M., 1995

机译：中间层对硅基板上超薄铜，金薄膜划痕附着性能的影响

Improved electro-mechanical performance of gold films on polyimide without adhesion layers

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