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Experimental Study of Diode Laser Cutting of Silicon by Means of Water Assisted Thermally Driven Separation Mechanism

机译：水辅助热驱动分离机理的二极管激光切割硅的实验研究

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Romero P.; Otero N.; Coto I.; Leira C.; González A.;
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年度 2013
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1. An investigation of energy loss mechanisms in water-jet assisted underwater laser cutting process using an analytical model [J] . Mullick Suvradip, Madhukar Yuvraj K., Roy Subhransu, International Journal of Machine Tools & Manufacture: Design, research and application . 2015,第Null期

机译：使用解析模型研究水射流辅助水下激光切割过程中的能量损失机理
2. The unbiased propagation mechanism in laser cutting silicon wafer with laser induced thermal-crack propagation [J] . Cheng Xiaoliang, Yang Lijun, Wang Maolu, Applied Physics . 2019,第7期

机译：激光诱导热裂纹传播的激光切割硅片的无偏传播机理
3. The unbiased propagation mechanism in laser cutting silicon wafer with laser induced thermal-crack propagation [J] . Cheng Xiaoliang, Yang Lijun, Wang Maolu, Applied Physics . 2019,第7期

机译：激光切割硅晶片中的非偏见传播机制，激光诱导热裂纹传播
4. Experimental study of diode laser cutting of silicon by means of water assisted thermally driven separation mechanism [C] . P. Romero, N. Otero, I. Coto, International WLT Conference on Lasers in Manufacturing . 2013

机译：借助于水辅助热驱动分离机构硅二极管激光切割的实验研究
5. Understanding fiber-coupled diode laser superheating in laser-assisted machining of silicon nitride (Si(3)N(4)). [D] . Panuganti, SriHarsha. 2009

机译：了解氮化硅（Si（3）N（4））的激光辅助加工中的光纤耦合二极管激光过热。
6. Experimental Analysis of Kerf Taper Angle in Cutting Process of Sugar Palm Fiber Reinforced Unsaturated Polyester Composites with Laser Beam and Abrasive Water Jet Cutting Technologies [O] . Fathi Masoud, S. M. Sapuan, Mohd Khairol Anuar Mohd Ariffin, 2021

机译：激光梁和磨料水射流切削技术糖棕榈纤维增强不饱和聚酯复合材料切割过程中Kerf锥角的实验分析
7. Considerations on assist gas jet optimization in laser cutting with Direct Diode Lasers [O] . Costa Rodrigues Gonçalo, Decroos Cédric, Duflou Joost 2017

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8. Experimental Determination of Thermal and Nonthermal Mechanisms for LaserDesorption from Thin Metal Films [R] . Li, Y., McIver, R. T., Hemminger, J. C. 1990

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Experimental Study of Diode Laser Cutting of Silicon by Means of Water Assisted Thermally Driven Separation Mechanism

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