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A Study on Pore-forming Agent in the Resin Bond Diamond Wheel Used for Silicon Wafer Back-grinding

机译：硅片背面研磨用树脂结合剂金刚石砂轮中成孔剂的研究

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Li Kehua; Guo Qiang; Liu Mingyao; Zhao Yanjun; Shi Dongli;
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1. Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material [J] . Zhenyu Zhang, Fengwei Huo, Yueqin Wu, International Journal of Machine Tools & Manufacture: Design, research and application . 2011,第1期

机译：使用混合键合材料的超细金刚石砂轮研磨硅片
2. High speed grinding of silicon nitride with resin bond diamond wheels [J] . Han Huang, Ling Yin, Libo Zhou Journal of Materials Processing Technology . 2003,第3期

机译：用树脂结合剂金刚石砂轮高速研磨氮化硅
3. Study of an on-line precision microgroove generating process on silicon wafer using a developed ultra-thin diamond wheel-tool [J] . Shun-Tong Chen, Shing-Jr Lin Diamond and Related Materials . 2011,第3期

机译：使用开发的超薄金刚石轮式工具在硅晶片上在线精密微槽加工工艺的研究
4. A Study on Pore-forming Agent in the Resin Bond Diamond Wheel Used for Silicon Wafer Back-grinding [C] . Kehua Li, Qiang Guo, Mingyao Liu, IUMRS International Conference in Asia . 2011

机译：用于硅晶圆的树脂粘合金刚石轮孔芯片背磨的研究
5. Thermal conductivity of diamond thin-films on silicon wafers [D] . Harrup, Marshall 2015

机译：硅晶片上金刚石薄膜的热导率
6. Nanoscale solely amorphous layer in silicon wafers induced by a newly developed diamond wheel [O] . Zhenyu Zhang, Liangchao Guo, Junfeng Cui, -1

机译：新开发的金刚石砂轮在硅片中产生纳米级的纯非晶层
7. Estudo comparativo entre a agressividade superficial obtida na retificação com rebolos de óxido de alumínio e CBN, fabricados com ligantes resinóide e vitrificado The evaluation of the bond resin and vitrified and abrasive grain CBN and alumina influence in the grinding wheel topography characteristics, by the study of the grinding wheel sharpness [O] . E. C. Bianchi, R. D. Monici, L. D. Neto, 2011

机译：通过研磨氧化铝和CBN砂轮获得的表面侵蚀性与树脂和玻璃化粘合剂的比较研究。砂轮的锋利度
8. Metal bond versus resin bond diamond abrasive grinding wheels in wet surface grinding [R] . F. HUGHES 1969

机译：湿表面研磨中的金属结合剂与树脂结合剂金刚石研磨剂砂轮

A Study on Pore-forming Agent in the Resin Bond Diamond Wheel Used for Silicon Wafer Back-grinding

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