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Directing Assembly of DNA-Coated Colloids with Magnetic Fields To Generate Rigid, Semiflexible, and Flexible Chains

机译:指导具有磁场的DNA包覆胶体的组装以产生刚性,半柔性和柔性链

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摘要

We report the formation of colloidal macromolecules consisting of chains of micron-sized paramagnetic particles assembled using a magnetic field and linked with DNA. The interparticle spacing and chain flexibility were controlled by varying the magnetic field strength and the linker spring constant. Variations in the DNA lengths allowed for the generation of chains with an improved range of flexibility as compared to previous studies. These chains adopted the rigid-rod, semiflexible, and flexible conformations that are characteristic of linear polymer systems. These assembly techniques were investigated to determine the effects of the nanoscale DNA linker properties on the properties of the microscale colloidal chains. With stiff DNA linkers (564 base pairs) the chains were only stable at moderate to high field strengths and produced rigid chains. For flexible DNA linkers (8000 base pairs), high magnetic field strengths caused the linkers to be excluded from the gap between the particles, leading to a transition from very flexible chains at low field strengths to semiflexible chains at high field strengths. In the intermediate range of linker sizes, the chains exhibited predictable behavior, demonstrating increased flexibility with longer DNA linker length or smaller linking field strengths. This study provides insight into the process of directed assembly using magnetic fields and DNA by precisely tuning the components to generate colloidal analogues of linear macromolecular chains.
机译:我们报告了胶体大分子的形成,该胶体大分子由使用磁场组装并与DNA连接的微米级顺磁性颗粒链组成。通过改变磁场强度和接头弹簧常数来控制颗粒间的间距和链的柔性。与以前的研究相比,DNA长度的变化允许生成具有改善的柔性范围的链。这些链采用了线性聚合物系统特有的刚性杆,半柔性和柔性构型。研究了这些组装技术,以确定纳米级DNA接头性质对微尺度胶体链性质的影响。使用刚性DNA接头(564个碱基对),链仅在中等至高场强下稳定,并产生刚性链。对于柔性DNA接头(8000个碱基对),高磁场强度导致接头从颗粒之间的间隙中排除,导致从低场强的高柔性链过渡到高场强的半柔性链。在接头大小的中间范围内,链表现出可预测的行为,表明具有更长的DNA接头长度或较小的连接场强度,从而提高了柔韧性。这项研究通过精确地调节组件以生成线性大分子链的胶体类似物,从而提供了对使用磁场和DNA进行定向组装过程的见解。

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