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Microstructures and strengthening mechanisms of Cu/Ni/W nanolayered composites

机译:Cu / Ni / W纳米层复合材料的微观结构与强化机理

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摘要

Cu/Ni/W nanolayered composites with individual layer thickness ranging from 5nm to 300nm were prepared by a magnetron sputtering system. Microstructures and strength of the nanolayered composites were investigated by using the nanoindentation method combined with theoretical analysis. Microstructure characterization revealed that the Cu/Ni/W composite consists of a typical Cu/Ni coherent interface and Cu/W and Ni/W incoherent interfaces. Cu/Ni/W composites have an ultrahigh strength and a large strengthening ability compared with bi-constituent Cu–X(X¼Ni, W, Au, Ag, Cr, Nb, etc.) nanolayered composites. Summarizing the present results and those reported in the literature, we systematically analyze the origin of the ultrahigh strength and its length scale dependence by taking into account the constituent layer properties, layer scales and heterogeneous layer/layer interface characteristics, including lattice and modulus mismatch as well as interface structure.
机译:通过磁控溅射系统制备了单层厚度为5nm至300nm的Cu / Ni / W纳米复合材料。结合纳米压痕法和理论分析,研究了纳米复合材料的微观结构和强度。微观结构表征表明,Cu / Ni / W复合材料由典型的Cu / Ni相干界面以及Cu / W和Ni / W非相干界面组成。与双组分Cu–X(X¼Ni,W,Au,Ag,Cr,Nb等)纳米层复合材料相比,Cu / Ni / W复合材料具有超高的强度和较大的增强能力。总结目前的结果和文献报道的结果,我们通过考虑组成层的特性,层尺度和异质层/层界面特性(包括晶格和模量不匹配),系统地分析了超高强度的起源及其与长度的关系。以及界面结构。

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