Electrical porcelains have been studied using fractographic methods. Typical strength controlling defects were quartz grains for an extruded low-alumina porcelain and pores for an isostatically pressed high-alumina porcelain. The fracture mirror constant was measured to 1.0 MN/m3/2 and the residual stress was estimated to approximately 90 MPa for the isostatically pressed porcelain.
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