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Low-cost PDMS seal ring for single-side wet etching of MEMS structures

机译:低成本PDMS密封环,用于MEMS结构的单面湿法蚀刻

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摘要

We describe a new O-ring setup for wet-etching processes of microelectromechanical systems (MEMS) . Our new low-cost approach using siloxane-based seal rings entails the single-side etching of silicon and silicon dioxide using potassium hydroxide and buffered hydrofluoric acid, respectively. With this approach, the wafer is not immersed into the etching solution, but only the side to be etched is in contact with the solution, hence the previously fabricated device elements on the other side of the wafer are not damaged. In one process for etching silicon the etch solution is heated by an infrared lamp. We describe the fabrication of various cantilever-based sensors, such as arrays of 0.8-um thick levers for a chemical/electronic nose, and 5-um-thick silicon cantilevers having piezoresistive sensors. Our technique has gooduniformity and process control and, in addition, eliminates mechanical stress on the fragile wafers incurred by wafer chucks, which are required for the conventional immersion approach. It has improved process yield and reduces the waste of chemicals.
机译:我们描述了一种用于微机电系统(MEMS)的湿法蚀刻工艺的新O形圈设置。我们使用基于硅氧烷的密封环的新型低成本方法需要分别使用氢氧化钾和缓冲氢氟酸对硅和二氧化硅进行单面蚀刻。通过这种方法,晶片没有浸入蚀刻溶液中,而只有待蚀刻的一侧与溶液接触,因此,在晶片另一侧上先前制造的器件元件没有受到损坏。在用于蚀刻硅的一种方法中,通过红外灯加热蚀刻溶液。我们描述了各种基于悬臂的传感器的制造,例如用于化学/电子鼻的0.8um厚的杠杆阵列以及具有压阻传感器的5um厚的硅悬臂梁。我们的技术具有良好的一致性和过程控制能力,此外,它消除了传统浸没方法所需的因晶片卡盘而对易碎晶片造成的机械应力。它提高了工艺产量并减少了化学药品的浪费。

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