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Effect of fluorosurfactant additive during Cu-Sn codeposition from methanesulfonic acid

机译:含氟表面活性剂添加剂在甲磺酸铜-锡共沉积过程中的作用

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摘要

Methanesulfonic acid (MSA) is an interesting supporting electrolyte with many desirable properties such as high salt solubility, high conductivity, low corrosivity and toxicity. Various additives or complexing agents such as brighteners, antioxidants, and surfactants are required for deposition of Sn and Cu-Sn alloys. It has been shown that the simplest electrolyte for successful Cu-Sn deposition can contain just an antioxidant and a fluorosurfactant. In this work we have further examined the role of fluorosurfactant in shifting the electrochemical reduction potential for the more noble metal. The surface adsorption and desorption processes of the surfactant has been inferred through the use of an electrochemical quartz crystal nanobalance (EQCN). Cu and Sn have been deposited individually and simultaneously from MSA electrolytes. Mass changes at the quartz crystal have been compared against those calculated from charge consumption. These data show that in MSA electrolytes the adsorption and desorption of the fluorosurfactant to the surface is potential dependent and it suppresses Cu deposition but facilitates Cu-Sn alloy deposition.
机译:甲磺酸(MSA)是令人感兴趣的辅助电解质,具有许多理想的特性,例如高盐溶解度,高电导率,低腐蚀性和毒性。 Sn和Cu-Sn合金的沉积需要各种添加剂或络合剂,例如光亮剂,抗氧化剂和表面活性剂。已经表明,用于成功进行Cu-Sn沉积的最简单的电解质可以仅包含抗氧化剂和含氟表面活性剂。在这项工作中,我们进一步研究了含氟表面活性剂在改变电化学反应对更贵金属还原电位方面的作用。通过使用电化学石英晶体纳米天平(EQCN)可以推断出表面活性剂的表面吸附和解吸过程。 Cu和Sn已分别从MSA电解质中同时沉积。石英晶体的质量变化已与电荷消耗计算得出的质量变化进行了比较。这些数据表明,在MSA电解质中,含氟表面活性剂在表面的吸附和解吸取决于电势,它抑制了Cu的沉积,但促进了Cu-Sn合金的沉积。

著录项

  • 作者

    Pewnim Naray; Roy Sudipta;

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  • 年度 2015
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  • 原文格式 PDF
  • 正文语种 en
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