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Cathodoluminescence hyperspectral imaging of trench-like defects in InGaN/GaN quantum well structures

机译:InGaN / GaN量子阱结构中沟槽状缺陷的阴极发光高光谱成像

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摘要

Optoelectronic devices based on the III-nitride system exhibit remarkably good optical efficiencies despite suffering from a large density of defects. In this work we use cathodoluminescence (CL) hyperspectral imaging to study InGaN/GaN multiple quantum well (MQW) structures. Different types of trench defects with varying trench width, namely wide or narrow trenches forming closed loops and open loops, are investigated in the same hyperspectral CL measurement. A strong redshift (90 meV) and intensity increase of the MQW emission is demonstrated for regions enclosed by wide trenches, whereas those within narrower trenches only exhibit a small redshift (10 meV) and a slight reduction of intensity compared with the defect-free surrounding area. Transmission electron microscopy (TEM) showed that some trench defects consist of a raised central area, which is caused by an increase of about 40% in the thickness of the InGaN wells. The causes of the changes in luminescences are also discussed in relation to TEM results identifying the underlying structure of the defect. Understanding these defects and their emission characteristics is important for further enhancement and development of light-emitting diodes.
机译:尽管存在大量缺陷,但基于III族氮化物的光电器件仍具有出色的光学效率。在这项工作中,我们使用阴极发光(CL)高光谱成像来研究InGaN / GaN多量子阱(MQW)结构。在相同的高光谱CL测量中,研究了具有不同沟槽宽度的不同类型的沟槽缺陷,即形成闭环和开环的宽沟槽或窄沟槽。较宽的沟槽所包围的区域表现出强的红移(90meV)和MQW发射的强度增加,而较窄的沟槽内的区域相比无缺陷的周围环境仅表现出较小的红移(10meV)和强度的轻微降低区域。透射电子显微镜(TEM)显示,某些沟槽缺陷由升高的中心区域组成,这是由InGaN阱厚度增加约40%引起的。还结合确定缺陷的基本结构的TEM结果讨论了发光变化的原因。了解这些缺陷及其发射特性对于进一步增强和开发发光二极管很重要。

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