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Simulation and Analysis of DDR3 Bus Based on Fly-By Topology with Cadence

机译:Cadence基于Fly-By拓扑的DDR3总线仿真与分析

摘要

For the requirements of different bus signals from high speed PCB with DDR3 components based on fly-by topology structure, coping strategies have been proposed respectively. For the address or command bus, a leveling-free strategy has been proposed. It shows that the phase difference can be nearly zero through reasonable constraints on PCB design. The strategy was applied to the clock bus and achieved good performance, combining with the rules of signal integrity. For the data bus, the timing sequence on source synchronous has been analyzed and the time margin was calculated. The reasonability of the design was verified through the simulation result with Cadence.
机译:针对基于飞越拓扑结构的DDR3组件高速PCB的不同总线信号需求,分别提出了应对策略。对于地址或命令总线,已经提出了一种无级策略。结果表明,通过合理的PCB设计约束,相位差可以接近于零。将该策略应用于时钟总线并结合信号完整性规则取得了良好的性能。对于数据总线,分析了源同步上的时序,并计算了时间裕度。通过Cadence的仿真结果验证了设计的合理性。

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