Numerical simulations of the effects of residual stresses in adhesively bonded composite specimen

摘要

In this work the problem of performing a numerical simulation of quasi-static crack propagation within an adhesive layer of a bonded joint under Mode I loading affected by stress field changes due to thermal-chemical shrinkage induced by cure process is addressed. Secondly, a parametric study on fracture critical energy, cohesive strength and Young's modulus is performed. Finally, a particular case of adhesive layer stiffening is simulated in order to verify qualitatively the major effect.