Cu was electrodeposited on AZ91 D Mg alloy with zincate pretreatment in an alkaline plating bath, and the effect of zincate pretreatment on adhesion strength of the Cu layer was investigated. Scanning electron microscopy results showed that Zn was mainly deposited on the α-phase surface, and ultrasonic agitation at the initial stage of the zincate pretreatment improved the coverage of the Zn layer even on the β-phase surface, resulting in enhancement of the adhesion strength of the Zn layer and the successive Cu layer to the substrate. Adhesion tests revealed that the plating layer peeled off at the mixed layer of Zn and Cu deposits formed at the interface between the zincated layer and the electrodeposited Cu layer. A smooth Cu surface was obtained in the plating bath containing H3BO3.
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机译：在碱性电镀液中对锌进行锌盐预处理，将铜电沉积在AZ91 D Mg合金上，研究了锌酸盐预处理对Cu层附着强度的影响。扫描电子显微镜结果表明，Zn主要沉积在α相表面上，并且在锌酸盐预处理的初始阶段进行超声搅拌提高了甚至在β相表面上Zn层的覆盖率，从而提高了粘合强度Zn层和相继的Cu层到衬底的距离。附着力测试表明，镀层在锌和铜沉积物的混合层上剥离，该沉积物形成在锌化层和电沉积铜层之间的界面处。在含有H 3 BO 3的镀浴中获得光滑的Cu表面。
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