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Investigating extremely low resistance ohmic contacts to silicon carbide using a novel test structure

机译:使用新颖的测试结构研究与碳化硅的极低电阻欧姆接触

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摘要

Low resistance contracts to highly doped silicon carbide (SiC) are investigated. Using a novel test structure that is easy to fabricate and easy to use, this paper demonstrates how it is used to reliably determine relatively low specific contact resistivities which vary with heat treatment. The test structure requires no error correction and is not affected by parasitic resistances. Using the test structure, small changes in specific contact resistivity are determined for small temperature changes. Results will be presented and discussed on the application of this novel test structure for nickel to highly doped SiC. 頨2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
机译:研究了对高掺杂碳化硅(SiC)的低电阻收缩。本文使用易于制造和使用的新型测试结构,演示了如何用它来可靠地确定随热处理而变化的相对较低的比接触电阻率。测试结构不需要纠错,也不受寄生电阻的影响。使用测试结构,可以确定较小的温度变化引起的比接触电阻率的较小变化。结果将介绍和讨论这种新颖的镍测试结构在高掺杂SiC上的应用。頨2013)COPYRIGHT光电仪器工程师协会(SPIE)。摘要的下载仅允许个人使用。

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