This paper presents finite-element frequency domain results for electromagnetic radiation emitted from high power microelectronic circuits connected to a heat sink. The heat sink model associated with one of the IEEE EMC challenging problems has been used to investigate three different grounding configurations. A new simulation model for the Intel P4 CPU heat sink is proposed and analyzed. A resonant frequency of 2.6 GHz with a reflection coefficient of 8.3 dB was found for the CPU heat sink. This is close to the IEEE and Bluetooth wireless communication system's operating frequency of 2.4 GHz. An optimal design of the CPU heat sink design should be performed in order to minimize the radiated emission from the CPU heat sink.
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