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Test set-ups for fast measurement of monolithic integrated circuits from on-wafer to system. application to a novel GaAs monolithic transimpedance amplifier for high speed optical communication systems

机译:测试设置,用于快速测量从晶圆上到系统的单片集成电路。在新型GaAs单片互阻放大器中的应用

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摘要

A fast, accurate and economical method for fully characterizing MMiCs from on -wafer to system measurements is presented as well as the corresponding set-ups. The method is applied to the evaluation of a GaAs monolithic transimpedance amplifier for the receiver of a high speed optical communication system. The device was firstly DC and RF measured on-wafer and on-chip in order to test the dispersion as well as for an initial selection of the chips. Using a test-fixture designed for fast on-carrier measurements the selected chips were tested on-carrier. Finally, employing the same carrier but a different test-fixture, optical/electrical measurements were done to evaluate the subsystem behavior. The efficiency of the measurement method is demonstrated in one hand and in the other the test results show that a transimpedance amplifier of excellent performances for high speed rate optical communication systems has been obtained.
机译:提出了一种快速,准确,经济的方法,可以全面表征从晶圆上到系统测量的MMiC以及相应的设置。该方法适用于评估GaAs单片跨阻放大器,用于高速光通信系统的接收器。首先在晶圆和芯片上对器件进行DC和RF测量,以测试色散以及芯片的初始选择。使用设计用于快速载波上测量的测试治具,可以在载波上测试所选芯片。最后,使用相同的载体但使用不同的测试夹具,进行了光电测量以评估子系统的行为。一方面证明了测量方法的效率,另一方面,测试结果表明,已经获得了用于高速光通信系统的性能优异的互阻放大器。

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