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Plan-View Preparation of TEM Specimens from Thin Films Using Adhesive Tape

机译:使用胶带从薄膜中制备TEM样品的平面图

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摘要

A simple plan-view sample preparation technique for transmission electron microscopy (TEM) specimens is proposed for thin films by tearing-off the film with adhesive tape. The demand for very thin samples is highest for nanostructured materials where the structure of 2–5 nm sized features (grains) needs to be resolved; therefore, overlapping of nanometer-sized features should be avoided. The method provides thin areas at the fracture edges of plan-view specimens with thickness in the range of the grain size in the film allowing for artifact free high-resolution TEM imaging. Nanostructured materials typically fracture between the grains providing areas with the thickness of the grain size. Besides the swiftness of the method, the samples are free of surface amorphization artifacts, which can occur in ion beam milling up to 1 nm depth even at low energy ion bombardment. The thin film tear-off technique is demonstrated on a CuMn alloy thin film with grain size of 2 nm.
机译:提出了一种用于透射电子显微镜(TEM)样品的简单平面图样品制备技术,该方法是通过用胶带撕下薄膜来制备薄膜。对于需要解析2-5 nm尺寸的特征(晶粒)的纳米结构材料,对非常薄的样品的需求最高。因此,应避免纳米尺寸特征的重叠。该方法在平面试样的断裂边缘处提供了薄的区域,其厚度在薄膜中的晶粒尺寸范围内,从而实现了无伪影的高分辨率TEM成像。纳米结构材料通常在晶粒之间破裂,从而提供具有晶粒尺寸厚度的区域。除了该方法的快速性之外,样品还没有表面非晶化伪影,即使在低能离子轰击下,离子束铣削中也可能出现高达1 nm的深度。在晶粒尺寸为2 nm的CuMn合金薄膜上证明了薄膜撕裂技术。

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  • 作者

    Czigány Zsolt;

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  • 年度 2011
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  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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