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Fabricating nanowire devices on diverse substrates by simple transfer-printing methods

机译:通过简单的转移印刷方法在各种基板上制造纳米线器件

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摘要

The fabrication of nanowire (NW) devices on diverse substrates is necessary for applications such as flexible electronics, conformable sensors, and transparent solar cells. Although NWs have been fabricated on plastic and glass by lithographic methods, the choice of device substrates is severely limited by the lithographic process temperature and substrate properties. Here we report three new transfer-printing methods for fabricating NW devices on diverse substrates including polydimethylsiloxane, Petri dishes, Kapton tapes, thermal release tapes, and many types of adhesive tapes. These transfer-printing methods rely on the differences in adhesion to transfer NWs, metal films, and devices from weakly adhesive donor substrates to more strongly adhesive receiver substrates. Electrical characterization of fabricated NW devices shows that reliable ohmic contacts are formed between NWs and electrodes. Moreover, we demonstrated that Si NW devices fabricated by the transfer-printing methods are robust piezoresistive stress sensors and temperature sensors with reliable performance.
机译:纳米线(NW)器件在各种基板上的制造对于诸如柔性电子设备,顺应性传感器和透明太阳能电池之类的应用而言是必需的。尽管已经通过光刻方法在塑料和玻璃上制造了NW,但是器件基板的选择仍然受到光刻工艺温度和基板性能的严重限制。在这里,我们报告了三种在不同基材上制造NW器件的新型转移印刷方法,包括聚二甲基硅氧烷,陪替氏培养皿,Kapton胶带,热释放胶带和许多类型的胶带。这些转移印刷方法依赖于粘附力的差异来将NW,金属膜和设备从弱粘附性供体基底转移到粘附性更强的接收器基底。制成的NW器件的电气特性表明,在NW和电极之间形成了可靠的欧姆接触。此外,我们证明了通过转移印刷方法制造的Si NW器件是坚固的压阻应力传感器和具有可靠性能的温度传感器。

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