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Top-gating of p-Si/SiGe/Si inverted modulation-doped structures

机译:p-Si / SiGe / Si反向调制掺杂结构的顶浇口

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摘要

Low-temperature electrical properties of two-dimensional hole gases (2-DHGs) in Si/Si0.8Ge0.2/Si inverted modulation-doped structures have been investigated at different hole densities using a metal semiconductor gate sputtered on top of these structures. The 2-DHG which is supplied to the inverted interface of Si/SiGe/Si quantum well by a Si boron-doped layer spatially grown beneath the alloy, was controlled in the range of 1.5–7.8×1011 cm–2 hole density by biasing the top gate. With increasing 2-DHG sheet density, the hole wave function of these structures expands and moves away from inverted interface, consequently the mobility enhances. These results may be understood theoretically by elaborating the role of interface charge, roughness, and alloy scattering mechanisms in limiting the mobility of holes at the inverted interface.
机译:使用溅射在这些结构顶部的金属半导体栅极,研究了在不同孔密度下,Si / Si0.8Ge0.2 / Si反向调制掺杂结构中的二维空穴气体(2-DHG)的低温电性能。通过在合金下方空间生长的Si硼掺杂层将2-DHG提供给Si / SiGe / Si量子阱的反向界面,并通过偏置将其控制在1.5–7.8×1011 cm–2的空穴密度范围内顶门。随着2-DHG片材密度的增加,这些结构的空穴波功能扩展并远离倒置界面,因此迁移率提高。通过阐述界面电荷,粗糙度和合金散射机制在限制倒置界面处空穴迁移率中的作用,可以从理论上理解这些结果。

著录项

  • 作者

    Sadeghzadeh, Mohammad Ali;

  • 作者单位
  • 年度 2000
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  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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