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RADIO FREQUENCY SIGNAL PROCESSING WITH MICROELECTROMECHANICAL RESONATING SYSTEMS

机译:微机电共振系统的无线电频率信号处理

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摘要

This thesis presents a study of the dynamics and applications of a high frequency micromechanical (MEMS) resonator. Mechanical systems, which have been scaled in dimension to the micron scale, show promise for replacing electrical resonant systems, which have larger physical size and lower performance. MEMS resonators can also be integrated into a chip containing conventional field effect transistors. A process incorporating both frequency dependent resonant systems as well as analog and digital electronics will enable all hardware in a communication architecture to be placed on a single silicon chip.In this study, a micron-sized circular membrane, suspended in the middle and clamped on the periphery, forms the basis of the resonant mechanical system. A small degree of curvature is fabricated into the resonator, which serves to stiffen the device and hence increase the frequency range. A microheater, defined in proximity to the resonator, is used to induce motion in the membrane. The frequency dependent response of the membrane is then detected through either interferometric or piezoresistive techniques. Resistive actuation and detection allow the membrane and actuators to be fabricated into a single plane of silicon, facilitating integration of the complete MEMS system. It is demonstrated how both the resonators and transducers can be implemented into two CMOS processes. Both designs incorporate the mechanical system as well as the solid-state electronics for output signal detection into a single fabrication process.Finally, the dynamics of the MEMS resonator, both in the linear and non-linear regime, are explored. The micron-sized mechanical system is demonstrated to perform several types of signal processing that are critical for wireless communication architectures. These studies shed new light on how the nonlinear dynamics of these systems may be characterized and harnessed for new applications.
机译:本文对高频微机械谐振器的动力学及其应用进行了研究。机械系统的尺寸已缩放至微米级,显示出有望取代具有较大物理尺寸和较低性能的电谐振系统。 MEMS谐振器也可以集成到包含常规场效应晶体管的芯片中。结合了频率相关谐振系统以及模拟和数字电子技术的过程将使通信体系结构中的所有硬件都可以放置在单个硅芯片上。在这项研究中,一个微米级的圆形膜悬挂在中间并固定在中间外围构成了共振机械系统的基础。在谐振器中制造了较小的曲率,这可以使设备变硬并因此增加频率范围。限定在谐振器附近的微型加热器用于在膜中引起运动。然后通过干涉或压阻技术检测膜的频率依赖性响应。电阻驱动和检测允许将膜和驱动器制造到单个硅平面中,从而有利于整个MEMS系统的集成。演示了如何将谐振器和换能器都实现为两个CMOS工艺。两种设计都将机械系统以及用于输出信号检测的固态电子器件整合到一个制造过程中。最后,探讨了线性和非线性状态下MEMS谐振器的动力学特性。微米级的机械系统被证明可以执行几种类型的信号处理,这对于无线通信体系结构至关重要。这些研究为如何表征和利用这些系统的非线性动力学提供了新的启示。

著录项

  • 作者

    Reichenbach Robert;

  • 作者单位
  • 年度 2006
  • 总页数
  • 原文格式 PDF
  • 正文语种 en_US
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