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Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques

机译:控制镀锌溶液,通过电化学技术确定硫脲添加剂的最佳浓度

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摘要

In this work we have analyzed the effect of thiourea concentration in the acid zinc deposition process. For these purpose, we have used the electrochemical techniques (cathodic voltammetry and Electrochemistry Impedance Spectroscopy, EIS). It allows determining the optimal concentration thiourea additive. In this range, we have obtained better finishes, more refined and decoratives layers. We have found in voltammetric studies that the electroreduction of Zn 2+ in the presence of thiourea is accelerated. The EIS studies has shown the “electrodeposition resistance” decrease in the presence of thiourea. The addition of more thiourea in the solution, in the optimum concentration, the electrodeposition resistance to the electrodeposition process is increased. The main contribution of this research and its scientific contribution is the use of electrochemical techniques for determining the optimal concentration of thiourea additive in the zinc electroplating solution in chloride acid media
机译:在这项工作中,我们分析了硫脲浓度在酸性锌沉积过程中的影响。为此,我们使用了电化学技术(阴极伏安法和电化学阻抗谱,EIS)。它可以确定最佳浓度的硫脲添加剂。在此范围内,我们获得了更好的饰面,更精致的装饰层。在伏安研究中我们发现,在硫脲存在下,Zn 2+的电还原被加速。 EIS研究表明,在存在硫脲的情况下,“电沉积电阻”降低。在最佳浓度下,在溶液中添加更多的硫脲,增加了对电沉积过程的电沉积阻力。这项研究的主要贡献及其科学贡献是使用电化学技术确定氯酸介质中锌电镀液中硫脲添加剂的最佳浓度。

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