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Environmental stress screening (ESS) by thermal cycling and random vibration: A physical investigation

机译:通过热循环和随机振动进行环境应力筛选(ESS):物理研究

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摘要

Temperature cycling and random vibration have proven to be the two most effective environmental stress screens. This study presents an extensive research on the physical quantification and optimization of temperature cycling and random vibration screens. For temperature cycling screen, a general model has been proposed to describe a typical temperature response cycle and a typical power-temperature response cycle. The least-squares parameter estimates for the two modified Arrhenius models are derived. Two general models for quantifying the equivalent aging acceleration factor of a typical temperature cycle with or without power cycling, considering both reaction rate stress and temperature change rate stress and also incorporating the temperature dependence of the activation energy, are derived. A closed form solution under the mixed-exponential life distribution assumption and an iteration equation solution under the Weibull distribution assumption, of the optimum number of temperature cycles for a specified post-screen field Mean Residual Life (MRL) goal, are established. For the random vibration screen, the distributions of the cumulative damage and fatigue life, under both stationary narrow-band and stationary wide-band random stressings, are derived under both-normal, semi-normal, and Markov-process assumptions. A bimodal mixed P-S-N diagram is proposed, from the failure physics point of view, to describe the fatigue strength of a non-screened unit. The concepts of the threshold S-N curve and the screening probability for fatigue defect precipitation are proposed to facilitate the quantification of random vibration screens. Finally, the closed form solution of the optimum vibration duration for a specified screening probability is derived under both-normal, semi-normal and Markov-process assumptions, respectively.
机译:温度循环和随机振动已被证明是两个最有效的环境应力屏蔽。这项研究提出了对温度循环和随机振动筛的物理量化和优化的广泛研究。对于温度循环屏幕,已经提出了一个通用模型来描述典型的温度响应周期和典型的功率-温度响应周期。推导了两个修正的Arrhenius模型的最小二乘参数估计。推导了两个通用模型,该模型在考虑或不考虑功率循环的情况下,对典型温度循环的等效老化加速因子进行了量化,同时考虑了反应速率应力和温度变化速率应力,并考虑了活化能的温度依赖性。建立了混合指数寿命分布假设下的封闭形式解和威布尔分布假设下的迭代方程解,该迭代解对于指定的筛后场平均剩余寿命(MRL)目标具有最佳温度循环数。对于随机振动屏,在正态,半正态和马尔可夫过程假设下,得出在固定窄带和固定宽带随机应力下的累积损伤和疲劳寿命分布。从失效物理的角度出发,提出了一个双峰混合P-S-N图,以描述非屏蔽单元的疲劳强度。提出了阈值S-N曲线的概念和疲劳缺陷析出的筛选概率,以方便量化随机振动筛。最后,分别在正态,半正态和马尔可夫过程假设下,得出针对特定筛选概率的最佳振动持续时间的闭合形式解。

著录项

  • 作者

    Sun Feng-Bin 1963-;

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  • 年度 1997
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