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Optimization of Polishing Kinematics and Consumables during Chemical Mechanical Planarization Processes

机译:化学机械平面化过程中抛光运动学和耗材的优化

摘要

This dissertation presents a series of studies relating to optimization of kinematics and consumables during chemical mechanical planarization processes. These are also evaluated with the purpose of minimizing environmental and cost of ownership impacts.In order to study diamond micro-wear and substrate wear during planarization processes, a series of static etch tests and wear tests were performed using different types of diamond discs and subjected to various treatments. Scanning Electron Microscopy (SEM) and Inductively Coupled Plasma Membrane Spectroscopy (ICPMS) were used to estimate the extent of diamond micro-wear and substrate wear.Next, the impact of various factors (type of slurry abrasive, pH, abrasive content and abrasive concentration) on pad wear rate during planarization process was studied. Another study in this dissertation focuses on the development of a novel technique of using coefficient of friction (COF) data to distinguish between good and bad diamond discs. This study made use of the innovative tool diamond disc dragging device (DDD-100) designed and developed for the purpose of this study.It is known that the performance of chemical mechanical planarization depends significantly on the polishing pad grooving type and the kinematics involved in the process. Variations in pad grooving type as well as pressure and sliding velocity can affect polishing performance. One study in this dissertation investigates the effect of pressure and sliding velocity on the polishing performance. The study is conducted on multiple pressure and sliding velocity variations to understand the characteristic of each condition. A subsequent study focuses on the impact of pad grooving type on polishing performance.The greatest contribution of this dissertation involves development of the novel slurry injector to optimize the utilization of slurry during planarization processes. Slurry is a critical component in chemical mechanical planarization processes and accounts for approximately 50 percent of the cost of ownership (CoO). The novel injector apart from reducing the consumption of slurry, also contributed in addressing problems associated with foaming, reduced the number of defects and achieved better within wafer non-uniformity (WIWNU).
机译:本文提出了一系列有关化学机械平面化过程中运动学和耗材优化的研究。为了评估对环境和拥有成本的影响,还进行了评估。为了研究平坦化过程中的金刚石微磨损和基底磨损,使用了不同类型的金刚石盘进行了一系列静态蚀刻测试和磨损测试,并进行了测试。进行各种治疗。使用扫描电子显微镜(SEM)和电感耦合等离子体膜光谱(ICPMS)来评估金刚石微磨损和基材磨损的程度。其次,各种因素的影响(浆料磨料的类型,pH,磨料含量和磨料浓度) )研究了平面化过程中垫的磨损率。本文的另一项研究集中在开发一种使用摩擦系数(COF)数据区分好和坏金刚石盘的新技术。这项研究利用了为该研究目的而设计和开发的创新工具金刚石圆盘拖动装置(DDD-100)。众所周知,化学机械平面化的性能在很大程度上取决于抛光垫开槽类型和所涉及的运动学过程。抛光垫开槽类型以及压力和滑动速度的变化会影响抛光性能。本文的一项研究研究了压力和滑动速度对抛光性能的影响。该研究是针对多种压力和滑动速度变化进行的,以了解每种情况的特征。随后的研究集中于垫槽的类型对抛光性能的影响。本论文的最大贡献涉及开发新型浆料注入器,以优化平面化过程中浆料的利用率。浆料是化学机械平面化工艺中的关键组成部分,约占拥有成本(CoO)的50%。除了减少浆料消耗之外,新型喷射器还有助于解决与发泡相关的问题,减少缺陷的数量并在晶片不均匀性(WIWNU)方面取得更好的效果。

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    Meled Anand;

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  • 年度 2011
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