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Adhesion Strength of BNT Films Hydrothermally Deposited on Titanium Substrates

机译:水热沉积在钛基底上的BNT膜的粘合强度

摘要

Lead-free piezoelectric (Bi1/2Na1/2)TiO3 (BNT) films were deposited on 1 mm thick pure titanium(Ti) substrates by a hydrothermal method. Tensile tests were performed to quantitatively assess the adhesion strength between BNT films and Ti substrates. Ti substrates were pretreated by chemical polish and mechanical polish respectively prior to BNT film deposition. In the tensile test, the behavior of BNT film exfoliation was investigated by the replica method. The critical Ti substrate strain inducing BNT film exfoliation was determined by the aid of finite element analysis (FEM). In this study, the results revealed that BNT film exfoliations were caused by the strain of Ti substrate, and the mechanical polish pretreatment improved the adhesion of BNT film to Ti substrate.
机译:通过水热法将无铅压电(Bi1 / 2Na1 / 2)TiO3(BNT)膜沉积在1毫米厚的纯钛(Ti)衬底上。进行拉伸测试以定量评估BNT膜与Ti基材之间的粘合强度。在沉积BNT膜之前,分别通过化学抛光和机械抛光对Ti基板进行预处理。在拉伸试验中,通过复制法研究了BNT膜的剥离行为。借助有限元分析(FEM)确定了引起Ti基体应变的临界BNT膜剥落。在这项研究中,结果表明BNT膜的剥落是由Ti衬底的应变引起的,并且机械抛光预处理提高了BNT膜对Ti衬底的附着力。

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