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On the Trimming of Resistance for Cermet Thin Films by Radio Frequency Sputter-Etching Method

机译:射频溅射刻蚀对金属陶瓷薄膜电阻的修整

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摘要

Electrical properties of Ta-SiO_2 cermet thin films prepared by diode RF. Sputtering were investigated, and RF. sputter-etching for these films was carried out with Ar gas. It was seen that Ta-SiO_2 cermet thin films had positive temperature coefficient of resistance when these were sputtered from the targets which had Ta area ratios over 50%. The resistivities for these films were about 500-700μΩ-cm. For the cermet thin films in this system, it was found that it was possible to perform the trimming of resistance with higher accuracy than that by chemical etching if the sputter-etching was carried out with RF. power of 100 watts.
机译:二极管射频制备Ta-SiO_2金属陶瓷薄膜的电性能研究了溅射,并进行了射频。用Ar气对这些膜进行溅射刻蚀。可以看出,当从Ta面积比超过50%的靶溅射出Ta-SiO_2金属陶瓷薄膜时,它们具有正的电阻温度系数。这些薄膜的电阻率约为500-700μΩ-cm。对于该系统中的金属陶瓷薄膜,发现如果使用RF进行溅射蚀刻,则与化学蚀刻相比,可以以更高的精度进行电阻的修整。功率为100瓦。

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