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Development of digital application specific printed electronics circuits : from specification to final prototypes

机译:开发数字专用印刷电子电路:从规格到最终原型

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摘要

This paper presents a global proposal and methodology for developing digital printed electronics (PE) prototypes, circuits and application specific printed electronics circuits (ASPECs). We start from a circuit specification using standard Hardware Description Languages (HDL) and executing its functional simulation. Then we perform logic synthesis that includes logic gate minimization by applying state-of-the-art algorithms embedded in our proposed electronic design automation (EDA) tools to minimize the number of transistors required to implement the circuit. Later technology mapping is applied, taking into account the available technology, (i.e., PMOS only technologies) and the cell design style (either Standard Cells or Inkjet Gate Array). These layout strategies are equivalent to those available in application specific integrated circuits (ASICs) flows but adapting them to Printed Electronics, which vary greatly depending on the targeted technology. Then Place & Route tools perform floorplan, placement and wiring of cells, which will be checked by the corresponding layout versus schematic (LVS). Afterwards we execute an electrical simulation including parasitic capacitances and relevant parameters. Finally, we obtain the prototypes which will be characterized and tested. The most important aspect of the proposed methodology is that it is portable to different PE processes, so that considerations and variations between different fabrication processes do not affect the validity of our approach. As final results, we present fabricated prototypes that are currently being characterized and tested.
机译:本文提出了开发数字印刷电子(PE)原型,电路和专用印刷电子电路(ASPEC)的全球建议和方法。我们从使用标准硬件描述语言(HDL)的电路规范开始,并执行其功能仿真。然后,我们通过应用我们提议的电子设计自动化(EDA)工具中嵌入的最新算法来执行包括逻辑门最小化在内的逻辑综合,以最大限度地减少实现电路所需的晶体管数量。考虑到可用技术(即仅PMOS技术)和单元设计样式(标准单元或喷墨门阵列),应用以后的技术映射。这些布局策略等同于专用集成电路(ASIC)流程中可用的布局策略,但使它们适用于印刷电子产品,具体取决于目标技术而有所不同。然后,放置和布线工具执行单元的布局,布置和布线,这将通过相应的布局与原理图(LVS)进行检查。之后,我们执行包括寄生电容和相关参数的电气仿真。最后,我们获得了将被表征和测试的原型。所提出方法的最重要方面是它可移植到不同的PE工艺中,因此不同制造工艺之间的考虑和变化不会影响我们方法的有效性。作为最终结果,我们介绍了目前正在表征和测试的预制原型。

著录项

  • 作者

    Llamas Manuel;

  • 作者单位
  • 年度 2015
  • 总页数
  • 原文格式 PDF
  • 正文语种 eng
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