首页> 外文OA文献 >回路論的手法に基づく回路網表現による複雑なレイアウト配線のクロストーク解析に関する研究
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回路論的手法に基づく回路網表現による複雑なレイアウト配線のクロストーク解析に関する研究

机译:基于电路理论的电路布局复杂布局布线串扰分析研究

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摘要

The research presented here is aimed toward developing a novel approach to analyzecrosstalk between transmission lines of complex configuration on high-speed digital printedcircuit boards (PCBs). The trend of modern electronics goes toward small packages andhigh performance. Together with this trend, electromagnetic interference (EMI) within theproduct itself such as crosstalk, important aspect of designing product for electromagneticcompatibility (EMC), becomes crucial day by day. As a typical method, multi-conductortransmission line (MTL) equations is often used to analyze crosstalk between wires in acable or traces on a PCB. However, this method is insufficient to analyze crosstalk betweenlines of complex configuration like those on practical PCBs because the solution of thismethod is restricted to the models of parallel lines having same length. Therefore, thisresearch proposes a new approach to analyze crosstalk between lines in various complexconfigurations like those on practical high-speed digital PCBs.MTL equations obtain the mutual coupling, that is, crosstalk between lines by the mutualcapacitance and the mutual inductance on the cross-section of transmission lines. That iswhy this method is restricted to the models of parallel lines having same length even thoughcrosstalk is easily analyzed. Therefore, other approaches are needed to analyze crosstalkbetween non-parallel lines or lines of arbitrary arrangement. In this thesis, an approach isdeveloped by regarding each transmission line as a transmitting antenna and a receivingantenna like an antenna theory familiar with us. Currents flowing on a transmission linegenerate electromagnetic fields and these fields affect nearby transmission lines and inducedistributed voltage and current sources on the lines. Thus, each line affects each otheras playing a role of a transmitting antenna and a receiving antenna. This is thoughtas the mutual coupling mechanism in this thesis. The proposed approach estimates thecoupling by directly calculating the mutual electromagnetic coupling between transmissionlines using a field theory based on the coupling mechanism mentioned previously. The linevoltage and line current is obtained by incorporating the mutual coupling taking by abovemechanism with the transmission line theory which have a good efficiency in that it is veryconvenient to solve the problem of line-structure propagating transverse electromagnetic(TEM) mode like that on PCBs dealt with here. We call this approach “Circuit-conceptapproach”.In this thesis, several models are set theoretically to estimate crosstalk using the circuitconceptapproach and experiment is conducted to verify the proposed approach. Thepatterns often seen on practical PCBs are not only parallel lines but also non-parallel lines,bend, vias and so on. Thus, we chose the models of bent lines having vias at the endsof the lines and obtained ABCD network expression for those to analyze crosstalk in thefrequency domain. Crosstalk between two microstrip lines in arbitrary directions on twodifferent layers including vias at both ends of lines such as line-structure on embedded PCBsare also theoretically analyzed by the circuit-concept approach. As a preliminary step, themodels in a homogeneous medium are analyzed. And then the models in an inhomogeneousmedium like the substrate on PCBs are analyzed. To obtain crosstalk between microstriplines on a PCB, we need accurately to estimate electromagnetic field in the substrate. Thus,the quasi-dynamic model is proposed to estimate electromagnetic fields in inhomogeneousmedia using an image theory. The proposed approach can be applied for the analysis ofmulti-conductor lines of complex structures, such as on multilayer PCBs, MCM.
机译:本文介绍的研究旨在开发一种新颖的方法来分析高速数字印刷电路板(PCB)上复杂配置的传输线之间的串扰。现代电子学的趋势趋向于小包装和高性能。伴随着这种趋势,产品本身内部的电磁干扰(EMI)(例如串扰)成为设计电磁兼容(EMC)产品的重要方面,已变得日益重要。作为一种典型的方法,通常使用多导体传输线(MTL)方程来分析PCB上导线或走线之间的串扰。但是,这种方法不足以像实际的PCB上那样分析复杂配置的线之间的串扰,因为该方法的解决方案仅限于具有相同长度的平行线模型。因此,本研究提出了一种新的方法来分析各种复杂配置中的线之间的串扰,例如在实际的高速数字PCB上.MTL方程获得互耦合,即通过横截面上的互电容和互感来实现线之间的串扰。传输线。因此,即使容易分析串扰,该方法也仅限于长度相同的平行线模型。因此,需要其他方法来分析非平行线或任意布置的线之间的串扰。本文通过将每条传输线视为发射天线和接收天线来发展一种方法,就像我们熟悉的天线理论一样。传输线上流过的电流会产生电磁场,这些场会影响附近的传输线,并在线上感应出分布的电压和电流源。因此,每条线在扮演发射天线和接收天线的角色时相互影响。这被认为是本文的相互耦合机制。所提出的方法通过使用基于前述耦合机制的场论直接计算传输线之间的相互电磁耦合来估计耦合。线电压和线电流是通过将上述机制的相互耦合与传输线理论相结合而获得的,具有很高的效率,因为它非常方便地解决了线路结构传播的横向电磁(TEM)模式问题,如在PCB上所处理的那样。在这里。本文将这种方法称为“电路概念方法”。在本文中,理论上建立了几种模型来使用电路概念方法估计串扰,并进行了实验以验证该方法。在实际的PCB上经常看到的图案不仅是平行线,而且还包括非平行线,弯曲,过孔等。因此,我们选择了在线的末端具有通孔的弯曲线的模型,并获得了ABCD网络表达式,用于分析频域中的串扰。通过电路概念方法,从理论上也分析了两个不同层上两个微带线之间在任意方向上的串扰,包括在线两端的通孔,例如嵌入式PCB上的线结构。作为第一步,分析了均质介质中的模型。然后,分析非均质介质(如PCB基板)中的模型。为了获得PCB上微带线之间的串扰,我们需要准确地估计基板中的电磁场。因此,提出了一种基于图像理论的准动力学模型来估计非均匀介质中的电磁场。所提出的方法可以用于复杂结构的多导体线的分析,例如多层PCB上的MCM。

著录项

  • 作者

    朴 庠昱; Sang-wook Park;

  • 作者单位
  • 年度 2016
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  • 原文格式 PDF
  • 正文语种 en
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