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Dislocations in Si-Doped LEC GaAs Revisited: a Spectrum Image Cathodoluminescence Study

机译:硅掺杂的LEC GaAs中的位错:光谱图像阴极发光研究。

摘要

The understanding of the role of impurities is crucial to semiconductor device technology, since all the devices are engineered by the selective incorporation of impurities. However, the incorporation of these impurities to the lattice and the resulting free charge concentration depend on the interaction with native defects. Dislocations in Si-doped substrates were studied in the nineties using highly sensitive DSL (Diluted Sirtl-Like) etching, SEM-EBIC (Electron Beam Induced Current) and microPL techniques. Both grown-in (G) dislocations, and grown-in dislocations glided (GS) by thermal stresses during post growth cooling were investigated aiming to understand the interaction between the dislocations and the doped GaAs matrix. CL spectrum imaging allows revisiting this problem supplying information about the defects forming the Cottrell atmospheres, and how they are distributed. By using a CCD multichannel detector it is possible to obtain the full spectral information over a selected area with submicrometric spatial resolution. The local spectra corresponding to the different regions of the dislocation atmosphere are available, allowing the identification of the different defects responsible for the luminescence emission. On the other hand, the use of fitting routines allows mapping the distribution of the different defects and impurities, providing a full scenario of the Cottrell atmosphere. The CL images are complemented with etching depth (using DSL) images obtained by Phase Stepping Microscopy.
机译:对杂质作用的理解对于半导体器件技术至关重要,因为所有器件都是通过选择性掺入杂质来设计的。然而,这些杂质向晶格中的结合以及所产生的自由电荷浓度取决于与天然缺陷的相互作用。在九十年代,使用高灵敏度的DSL(稀释的Sirtl-Like)蚀刻,SEM-EBIC(电子束感应电流)和microPL技术研究了掺Si衬底中的位错。为了了解位错与掺杂的GaAs基体之间的相互作用,研究了生长后(G)位错和生长后冷却期间因热应力而滑行的(GS)位错。 CL光谱成像可以提供有关形成Cottrell气氛的缺陷及其分布方式的信息,从而可以重新审视此问题。通过使用CCD多通道检测器,可以获得具有亚微米空间分辨率的选定区域上的全部光谱信息。可获得与位错气氛的不同区域相对应的局部光谱,从而允许识别负责发光发射的不同缺陷。另一方面,拟合程序的使用允许绘制不同缺陷和杂质的分布图,从而提供了科特雷尔大气的完整场景。 CL图像补充有通过相位步进显微镜获得的蚀刻深度(使用DSL)图像。

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